A millimeter-wave intra-connect solution

The number and bandwidth of the internal I/O's in today's highly sophisticated electronic systems have grown faster than the external ones [1]. This demand for multiple, high-speed short-range internal I/O's results in several product design issues. In many cases, the number of I/O's, instead of actual circuits, determines the SoC chip size. The wires and connectors limit mechanical design flexibilities and the physical and topological challenges of such wired interconnects can affect the system performance and reliability. Furthermore, wired connections are never free as they require additional on-chip drivers to maintain signal integrity. This results in additional dynamic power dissipation and adds to the component and implementation costs of the system.