Thermal Analysis of the Multi-Chip Vertical Packaged White LED

In this paper, thermal management of the multi-chip vertical packaged (MCVP) white LED is presented. The steady state thermal resistance (R
_T
) and thermal resistance constitution is obtained by transient response testing based on electrical method. R
_T
is 10.37degC/W. The chips and package body contributes 2.63degC/W and 7.74degC/W respectively. The temperature distribution of the MCVP LED is obtained by 3-dimensional finite element method (FEM) simulation. By comparing heating response curves among different package forms' LED samples, the MCVP sample shares lowest steady state temperature rise with the metal alloyed substrate sample, which is lower than 18.3degC of the single flip-chip sub-mounted device (SMD) sample and 15.3degC of the multi-chip horizontal packaged (MCHP) sample.