Hermeticity Testing and Failure Analysis of MEMS Packages

Microsystem devices contain movable and fragile parts that The gross leak test covers leak rates above RLG = 10-4 must be encapsulated for reasons of protection such as mbar.l/sec [6]. The lower limit RLF of the fine leak test is handling, wafer dicing or 1st and 2nd level packaging given by the lower sensitivity of the He leak detector (RLF processes, such as plastic moulding. Hermeticity of these 0.4xIO-9 mbar.l/sec). But more important is the upper limit packages is essential for a large number of MNT RUF of the fine leak test. This cannot be defined easily, as it applications to avoid contamination and ensure a stable and is a function of the cavity volume to be tested.