A new LSI bonding technology 'Micron bump bonding assembly technology'

A novel LSI chip bonding method called the micro-bump bonding method was developed for direct bonding between the large-scale integrated (LSI) electrode and the electrode provided on the circuit substrate. In this method, the shrinkage stress generated in light-setting insulating resin results in a compressive force on the LSI chip against the electrodes on the substrate. LSI chips having an interelectrode spacing of 10 mu m and 2320 electrodes in total were successfully gang bonded in a face-down form with high reliabilities.<
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