Three dimensional finite element simulation of wire looping process in wirebonding

This paper describes a fully three-dimensional finite element simulation of the wirelooping process in ball-wedge wirebonding. The three-dimensional geometry of the wirebonder capillary is utilised and the free interaction between the capillary and the wire simulated. The effect of wire-tensioning is studied and the "kick up" effect of the wedge bonding process was simulated. Good agreement between simulated and actual wirebond profiles is obtained.