Obtainable microstructures in electrical conductors made of a copper-silver alloy

The goal of this study was to understand the relationships between the obtainable properties of copper-silver conductor alloys and the material's microstructure. Processing routes to obtain property combinations of high yield strength and high electrical conductivity were desired. The processing method involved melting and casting of pure elemental materials in selected mass ratios, electrical discharge machining of rectangular prismatic blocks from the cast billets, and flat rolling of the blocks to a 51% reduction in thickness. Standard electrical conductivity and hardness measurements were made. The microstructures of the cast ingots and of the rolled materials were evaluated. It was observed that manipulation of the processing parameters and microstructure produced material with room-temperature yield strengths of 600 MPa and corresponding electrical conductivities of 85% IACS at a 51% thickness reduction. These property values are sufficient for use of this alloy in either the as-cast state or in the cast-and-rolled state.