Practical Adhesion of an Ag - Pd Thick-Film Conductor: An Acoustic Emission Study of Pull Tests-I: Monitoring System and Initial Adhesion

The practical adhesion of an Ag-Pd thick-film conductor on 96-percent alumina was investigated using an acoustic emission monitoring system with a 90° bent wire pull-test configuration. The strength values were highest when an interlocking interface between the metal and substrate was formed. The fracturing of the different interfaces developed during under-, over-, and optimum firing conditions was distinguishable from the acoustic emission data recorded during the adhesion tests.