Application of PCB Strain Testing in Micro-inertial Measurement Unit MEMS

This article uses the Wheatstone bridge principle to build a system for testing tiny deformations on the PCB board of MEMS components. This study shows that PCB strain testing can optimize the stress tolerance of micro-inertial measurement MEMS during assembly and use, thereby ensuring the system accuracy of MEMS and improving the reliability of electronic components. Through the research of this article, it is found that when the micro-inertial measurement unit MEMS is assembled, the maximum principal strain is 27.5με, and the direction is the vertical screw installation direction and parallel to the mechanical backing surface of the MEMS installation shell. When the temperature is lower than −20°C or the temperature is higher than 50°C, the MEMS assembly stress deteriorates significantly.