Optimizing the Pressing Process of BGA-FP: A Lean Six Sigma Initiative for Defect Reduction in the Microelectronics Industry

ABC Microelectronics, Inc. specializes in providing flexible printed boards, connectors, test & burn-in sockets, and precision plastic injection molding. This study is focused on defect reduction in the BGA-FP (NP568) #ME pressing process while proposing process enhancements. Lean Six Sigma methodologies were applied to improve the process and address the factors contributing to defects. Presently, the defect percentage stands at 41%, surpassing the upper control limit of 41.13%. Both figures exceed the maximum allowable threshold of 15%, highlighting an inability to achieve a 95% confidence level interval. Additionally, the Process Z score falls short of the targeted 2.0, measuring at 0.2275. Analysis of the BGA-FP (NP568) process revealed that insufficient #ME pressing was the key factor leading to defects in the production process of micron products. To counter this issue, a customized tool was introduced, resulting in a noteworthy decrease in the defect percentage to 1.74% and an improved Process Z score of 2.11%. To sustain these improvements, work instructions were implemented alongside the development of a comprehensive process flow control plan.