Dynamic Analysis of No-Insulation Insert Coil Under Changing Background Magnetic Field

Due to the excellent thermal stability and high-power density in steady state, no-insulation (NI) winding technology is widely used in the application of superconducting magnets. However, current ripple and background magnetic field fluctuations caused by relative devices result in changing turn-to-turn current of the NI insert magnet, which will impose a great impact on the thermal stability of the NI magnet. This paper analyzes the thermal characteristics and other electromagnetic parameters of NI magnet under dynamic operating conditions by improved 2D finite-element method. The results provide references of thermal conductive structure design and assessment of operational reliability of NI magnets in changing working conditions.