1. Introduction
FeFETs are viable candidates for CIM applications due to their multi-level operation, high on/off ratio, non-volatility, and compatibility with CMOS technology [1]. However, their narrow MW and bad endurance critically degrade the reliability of CIM. To overcome these challenges, we propose comprehensive strategies spanning material design, device structure, and array architecture. As a crucial facilitator for CIM, excellent ferroelectricity in relatively thick layers was proposed from a thermodynamics point of view. Furthermore, the MFMIS FeFET device with an outstanding FE layer displayed notable device properties with a wide-range MW V), high switching speed and outstanding endurance ( cycles), which can be attained by combining the effects from both material and device. In addition, the FeFET-PIM array, comprising developed FeFETs, could achieve high linearity in VMM operation. With the developed FeFET, which is capable of saving eight states in a single cell, our PIM array exhibited good area efficiency. The results in this paper can be a possible research platform for the research of future advanced computing devices.