In-Depth Analysis of Bonding Interface at Die Level Hybrid Bonding

This study reveals bond interface characterization of chip-level hybrid bonding. Robust direct bonding interfaces withstand extreme environmental tests. Our innovative approach facilitates bond strength measurements in D2W bonding, offering novel methods to qualify the processes and the integrations. Nano-indentation also shows that D2W and W2W are indistinguishable in terms of bond strength, emphasizing the importance of ongoing investigations into their relationship. This breakthrough enhances the understanding of hybrid bonding, urging further exploration.