High Speed D2D Interface Applied on Advanced Package

The research and discussion in this paper, there are package design with the structure of FOCoS (Fan Out Chip on Substrate) for an actual high-performance computing IC device with ASIC (Application Specific Integrated Circuit) chips and HBM (High Bandwidth Memory) chips. In the process of this study, the die-to-die (D2D) interconnection between ASIC chip to ASIC chip is used UCIe (Universal Chiplet Interconnect Express) interface for high speed signal transmission and HBM3/HBM3e is applied on data transfer between ASIC chip to high bandwidth memory. Through electrical analysis, the suitable RDL (Re-Distribution Layer) structure and routing topology are applied on various interface.