RDL Embedded Coreless Substrate for Hetelogenious Integlation

We proposed RDL embedded coreless substrate (RECS) for heterogeneous integration. It has a structure in which both sides of the L/S=2/2 μm fine pitch redistribution layer (RDL) are reinforced with Low CTE organic materials. This structure allows it to exist independently without FCBGA or carrier, and various benefits are expected. We conducted mechanical property measurements and FEM analysis as a proof of concept. Test vehicle (TV) was also fabricated to confirm the feasibility of the process.