Finite Element Analysis of Super Ball Grid Array Packages Mounted in Printed Circuit Board

Finite element analysis (FEA) was used to predict the performance of Super Ball Grid Array (SBGA) assemblies with Megtron6 and FR-4 PCB laminates. The material properties of different constituent of Super Ball Grid Array package were determined through nanoindentaion tests, and tensile tests. Results revealed that the SBGA more compatible with stiffer board.