Research on Structure Reliability Design Technology of High Power Ceramic Based Microsystem package

In recent years, China has made rapid progress in the field of microsystem technology through independent innovation, which has also led to profound changes in the design concept of electronic information system architecture. It has begun to move from the research stage of basic theory to the stage of engineering research and development, especially in the field of high-power microsystems, and has made breakthrough progress. Due to the large number of integrated chips, high density, and high reliability requirements of microsystems, most microsystems adopt ceramic solder pillar array CCGA package with high package density, good thermal performance, and good airtightness. The package and substrate are designed as an integrated design, greatly saving layout space. As the carrier of microsystems, the structural reliability of ceramic package plays a crucial role in the performance of microsystems. Therefore, based on the high-density multi-layer co fired ceramic technology system, this paper uses finite element analysis software to conduct a systematic simulation study on the structural reliability of microsystem package, forming structural design rules for large-sized and highly reliable package suitable for microsystem package. In this paper, multi-level parts matching technology is mainly used to solve the thermal stress problem caused by the large difference of coefficient of thermal expansion between different parts of the large-scale micro system package. Microsystems designed using this technology have advantages such as high reliability, high density, and high performance, low power consumption, and short design cycles.