Influence of Cu heat sink on heat dissipation of QFN package

This paper focuses on the key factors that contribute to the success of QFN component applications, namely, structural design and thermal analysis. By means of extensive research, we have successfully developed a customized Cu heat sink QFN model that is specifically designed to meet the stringent requirements of package design and assembly. This model incorporates innovative features and considerations derived from our comprehensive investigations, allowing for an optimized thermal management solution within the QFN package. The design and implementation of the Cu heat sink serve to address the increasingly demanding challenges associated with heat dissipation in QFN packages, ensuring efficient thermal performance and enhancing the overall reliability of the package. Through our research efforts, we have made advancements in QFN design and assembly. Using finite element simulation techniques, we are able to analyze the temperature and stress levels of the package, ensuring optimal heat dissipation. Our experimental results have demonstrated that the heat sinks, located both inside and outside of the QFN, are highly effective in reducing QFN temperature while stress vary slightly. It is evident from simulations that adding both internal and external heat sinks in QFN package can significantly improve heat dissipation and enhance packaging reliability.