Research on heat dissipation performance of double-sided cooling IGBT module

Double-sided cooling (DSC) IGBT module has been greatly improved in heat dissipation performance and has been widely used. However, the heat dissipation efficiency of the two heat paths is different, which will reduces the service life and reliability of the module. In this paper, the finite element Analysis (FEA) is used to analyze the three-dimensional heat transfer model of DSC IGBT module, and the influence of the material layers inside DSC IGBT module on the heat dissipation performance is researched. The results were analyzed by orthogonal design. The results show that the height and material of spacer have great influence on the heat dissipation performance of DSC IGBT module, but the influence of the material of the mold compound and solder is not obvious. When the height of the spacer is 1.5mm, the spacer material is Ag, the mold compound material is Phenolic resin, and the solder material is Nano-silver paste, the heat dissipation efficiency of the two heat paths of the DSC IGBT module is the closest.