Die Attach for Microelectronic Packaging: Copper Paste Comparison Between Pressure and Pressureless Techniques

With the development of wide-bandgap semiconductors, higher requirements for the strength and reliability of power semiconductor device connections have emerged. Die attachment is an effective way to address these issues in microelectronic packaging, however, there are still many challenges and limitations. Pressure copper sintering has become one of the potential solutions to address those problems. However, in the case of large-scale integral connections, pressure may lead to problems such as uneven connection and bonding. Therefore, pressureless sintering in micro-connections has become a new challenge. This work mainly made some attempts in pressureless copper sintering. The results obtained in terms of bonding strength can already be compared with the results of pressure sintering, and some progress has been made in pressureless copper bonding.