Structure Optimization Design of Interfacial Failure Resistance for Composite Film in Flexible Electronics

In recent years, the rapid development of flexible electronic devices has necessitated the exploration of new materials and design techniques to ensure their reliability, durability, and functionality. Composite materials with tunable local stiffness have emerged as a promising solution, offering enhanced mechanical stability and adhesion toughness for the normal operation of these devices. This paper presents a comprehensive investigation of the application of these composite materials in flexible electronic devices, introducing a soft-hard material topology optimization method based on different objective functions to further enhance the interfacial anti-failure capabilities of these composite structures.The study begins with the utilization of a cohesive model to simulate the interfacial failure process of multi-layer structures. By manipulating the distribution and proportion of hard particles within the soft matrix in composite materials, the local stiffness of the structure can be controlled to optimize energy dissipation. Moreover, the objective function can be tailored to satisfy specific performance requirements, such as maximizing strength or minimizing tensile force, depending on the intended application. The comparison of composite film structures before and after optimization revealed a marked improvement in adhesive toughness, demonstrating the potency of the proposed topology optimization method. Furthermore, the optimization results under diverse loading conditions underscore the wide-ranging applicability of the technique across an extensive array of composite film structures.