Reliability influence of solder joints on gold plated carriers

With the application of devices in high-frequency microwave board gold-plated solder pads, the gold embrittlement failure behavior of SnPb solder joints has become a problem that must be considered in aerospace product manufacturing. In response to the current problem of gold containing solder joint failure in the electrical interconnection process of aerospace products, this paper analyzes and reviews the research status and trends at home and abroad from the standard requirements of gold plating, tin plating, and gold removal treatment, as well as the interface reaction behavior that leads to gold embrittlement failure behavior. This analysis uses ANSYS Workbench for temperature field analysis and ANSYS APDL solver for solution. Use ANSYS post-processing to calculate the temperature distribution of the model to view the results and cloud images, and provide guidance for subsequent reliability analysis. The influence of welding temperature on the distribution of Au element was analyzed from the perspective of production process, which has a crucial impact on the stability of welding