Research on Quality Control of Thermal Ultrasonic Wire Bonding Based on PFMEA and SPC

In microelectronic packaging, the quality of wire bonding can directly affect the quality and long-term reliability of microelectronic devices. For the reliability of wire bonding, this paper proposes a quality control method for thermal ultrasonic wire bonding based on process failure mode and effects analysis (PFMEA) and statistical process control (SPC). This method conducts PFMEA analysis on thermal ultrasonic wire bonding and establishes failure mode evaluation indicators suitable for wire bonding characteristics. By introducing SPC technology during the analysis process, a quantitative analysis was conducted on the stability of bonding tension data, forming an effective method for controlling the quality of wire bonding. The application indicates that the weak links of the bonding process are effectively controlled, which improves the reliability of the bonding process and provides technical support for the process quality control.