Reliability Analysis and Evaluation of Epoxy Resin Adhesive for LED Encapsulation

The LED packaging adhesive plays a crucial role in LED devices, which not only needs to have good light-emitting efficiency and heat dissipation performance, but also must be able to provide sufficient protection for the chip to prevent corrosion or mechanical damage caused by long-term exposure to air, thereby improving the stability of the chip and extending the life of LED. This article reviews the commonly used materials and their characteristics for LED packaging adhesive, and analyzes the advantages and disadvantages of epoxy resin packaging adhesive. By analyzing LED failure cases, the main mechanisms of LED failure caused by epoxy resin packaging adhesive are summarized. In addition, this article analyzes the reliability evaluation methods of epoxy resin packaging adhesive and provides suggestions to enhance the reliability and stability of LED epoxy resin packaging adhesive.