Dielectric Characterization for Secure and Reliable High-Frequency Printed Circuit Board Applications

Printed Circuit Boards (PCBs) are ubiquitous in electronic devices, especially crucial in high-speed PCB-based systems, facilitating component integration, signal transmission, and signal integrity maintenance. The alteration of PCB board materials can lead to severe consequences and system failures. For that, high-speed systems demand precise PCB substrate materials to prevent undesirable effects like signal attenuation and compromised signal integrity. Among the crucial parameters, the dielectric property of the board material stands out. This paper examines the critical role of Printed Circuit Board (PCB) substrate materials in high-speed systems, highlighting potential repercussions and vulnerabilities due to inadvertent material changes. Tailored for high-speed systems, the meticulous selection of appropriate PCB substrate materials is essential to avoid signal attenuation and compromised signal integrity. A pivotal aspect of this study is the dielectric property of PCB material, necessitating innovative methodologies for accurate determination. The paper proposes a proof of concept of an on-board circuitry method to measure the dielectric constant of the underlying PCB material. This involves generating diverse high frequencies and conducting computations to derive the dielectric constant. The paper provides a comprehensive circuit model and procedural guidelines for successful implementation. Essential equations for PCB design and computation are detailed. The paper also outlines FPGA chips meeting solution requirements, suggesting avenues for practical implementation. Simulation results of the proof of concept provide compelling evidence that addresses the pivotal role of PCB substrate materials in high-speed systems, offering an innovative approach to determine dielectric properties through a combination of circuitry and computation. We conclude that our approach can be helpful to preserve signal integrity and alleviate challenges in high-speed electronic configurations.