High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress–Strength Interference Modeling

With the wide application of packaging devices in weaponry, the reliability of packaging devices under high overload conditions has gradually become a focus of attention. In this article, a failure rate prediction method for packaging devices based on a stress–strength interference model combined with finite element analysis and statistical methods is proposed. The method statistically analyzes the structural stress distribution of the device by performing time-domain high-impact transient simulations on a finite element model of the packaging device. The results show that the reliability of the critical structure under high overload conditions is Wire > Solder > Pin. The elastic modulus of the material is further characterized by numerical simulation and the data are extracted and fit in to obtain the stress probability density function (pdf). At the same time, the probability density function of yield strength under different confidence levels is obtained by combining with the dynamic yield strength calculation of materials to realize the quantitative calculation of the failure rate of low-profile quad flat package (LQFP) package devices. The research in this article realizes a fast quantitative assessment of the reliability of packaged devices under high overload loads.