Study on Mechanical Properties of Rice Husk Fiber-Based Polishing Pad for Chemical Mechanical Polishing of Sapphire Substrate

This research studies the possibility of creating a rice husk fiber-based polishing pad for sapphire substrate in chemical mechanical polishing; (CMP), including mechanical properties. It is a way to reduce the rice husk that was left over from the rice milling process and decrease the costs for LED bulbs to meet the growing demand every year. After washing and sizing (80 mesh), rice husk fiber will be mixed with polyurethane content 0, 2.5, 5, 7.5, and 10 phr rice husk fiber. As a result, it shows that the rice husk fiber-based polishing pad could be formed with good dispersibility. The hardness of the rice husk fiber-based polishing pad was lower than pure polyurethane by 13.6% at a mixing ratio of 2.5 phr and higher linearly when the rice husk increased. Similarly, the abrasion test of the rice husk fiber-based polishing pad shows the lowest abrasion resistance at 5 and 10 phr rice husk content.