Forward-Looking Roadmap View to Enable Heterogeneous Integration in the Next 10 Years

This study discusses the trends and challenges in the heterogeneous integration packaging roadmap. These trends illustrate the trends of various parameters, such as real estate size of both package substrate and silicon die, power density, thermal solution resistance, ball grid array, and coplanarity/warpage of the package. The present work highlights the need for future thermal solutions to comply with several key points which were raised before in the prior art.. These factors are given to ensure that the developing future thermo-mechanical solutions are accommodating new technology.The current investigation concluded that the heterogeneous integration on the package level will be coming to end by 2033. At that time, the heterogeneous integration need to be accomplished using the System on Wafer approach.