Wire loop characterization for wire sweep reduction

Wire bonding process is widely used in packaging manufacturing to connect integrated circuits and leadframes/substrates. In the process of encapsulation by epoxy molding compound, wires are swept by the resin flow. Wire sweep can be responsible for short circuit when it is not kept under control. The risk is higher for complex bonding diagrams, with multiple loops, fine pad pitch and overlapping wires. Based on a multivariate statistic, together with the support of a statistical software, this paper attempts to provide a guideline on how to improve the bonding profile in the view of wire sweep reduction.