Backside Metallization for Logic Applications

HPC (High Performance Computing) is a powerful tool that can be applied to solve intricate problems and overcome obstacles in diverse areas such as life science, environmental sciences, industrial and finance. To achieve high computing power, cutting-edge system-on-chips (SOCs) or next generation advanced packaging technologies are utilized to integrate processors, memory, and storage either on die or at the package level. However, a critical hurdle in these technologies is to effectively manage the heat generated in order to preserve computing performance and power efficiency. In this context, we will discuss the challenges and present latest progress in thin film deposition of a solderable layer stack deposition on the wafer backside to allow a perfect, reliable connection to the thermal interface material (TIM) . This back side metal (BSM) stack has not only to meet excellent adhesion and solderability, but also minimum film stress requirements and compatibility to limited process temperature budgets imposed by increasingly popular Electronic Mold Compound or EMC substrates applications.