Virtual Design of Experiment Methodology for Package Design Robustness

Several studies have been performed to develop reliable package warpage models for laminate based BGAs. Warpage is a critical issue during a number of stages in a product’s life cycle. From manufacturing, through testing, mounting on board and during its operational lifetime warpage can cause bottlenecks and criticalities that may lead to failure or manufacturing yield loss. Typically when addressing warpage a device should be designed both for manufacturability and reliability. This may pose many challenges due to conflicting trends, especially when taking into account different temperature points. Since several factors come into play and several responses are needed to take a design decision, developing the right methodology for decision making is important.