INTRODUCTION
Radio frequency (RF) power measurement is critical in telecommunications for increasing power and spectrum efficiency. Currently, heat- or diode-based solutions are commonly used for power sensing. The former, including thermistors and thermocouples, do so by dissipating RF power and measuring the temperature increase within a resistive termination, offering some advantages in terms of accuracy, linearity, and stability but at the cost of few to tens of ms response time. The latter, on the other hand, uses rectification of the voltage across the resistive termination, offering fast response time, wide dynamic range, and highest degree of compatibility with different scenarios and applications [1]. The main drawbacks of diode-based solutions are high temperature induced drift of output and cost considerations regarding power consumption, matching, and chip area at gigahertz range [2].