Advanced Investigations of On-board Interconnection Structures using 2D/3D Electromagnetic Field Analysis Methods

The paper presents various advanced investigations of on-board interconnection structures using cutting-edge 2D/3D electromagnetic analysis techniques. The scientific work's main objective lies in the design and development of high-density interconnections within laminated substrates of complex integrated circuit packages. Specifically tailored for "flip-chip" technology chips/dies, the activity aims to scrutinize, optimize, and validate these structures according to stringent engineering requirements.