Research of Low-Cost Technological Process for Manufacturing of One Side Silicon Interposer

to manufacture silicon interposers, back-end (BEOL) semiconductor production processes are commonly used. This processes providing minimal topological norms, but at the same time leading to a more complex and expensive production. However, minimum norms are not always a priority for interposers, especially if we are talking about small-scale production. In this work we studied the possibility of obtaining single-sided silicon interposers with 10 μm norms using low-cost standard electronics manufacturing processes, such as vacuum metal deposition, liquid etching of the copper pattern and plasma chemical etching of dielectric in oxygen plasma through a photoresist mask.