UV Laser Copper Pad Surface Exposure for Laser Direct Structuring (LDS) of Interconnection

Microelectronics market demands strong miniaturization and high-quality packages solutions; therefore, companies and researchers start thinking about alternative methods to create more flexible and performing interconnections which are able to reduce package dimensions. Laser direct structuring (LDS) technology creates a conductive pattern on MID (Moulded Interconnected Device) with the combination of laser layout structuring and electroplating bath. LDS can be applied to leadframe based IC packages to realize interconnections in alternative to standard wires connection. Feasibility study on copper (Cu) pad covered by moulding compound is conducted varying laser parameters as power, frequency and scanning speed to obtain a
$80\mu\mathrm{m}$
diameter via on die. Die via is connected through a trace with a
$200\mu\mathrm{m}$
diameter via on lead to realize the interconnection path, filled with copper after plating process. UV 355nm wavelength laser is used to obtain a complete exposition of Cu surface without silicon damage. Visual inspection with optical microscope and SEM analysis method are performed to evaluate the integrity of metal pads and interconnection layout.