Transient Thermodynamic Simulation of Micro LED Array Bonding

Micro LED display technology is considered to be the next generation of display technology and finds widespread applications in displays and visible light communication. Key cooperation plays a crucial role in achieving electrical interconnections for Micro LED, which significantly impact their luminous quality and reliability. This study aims to analyze the stress-strain evolution during the bonding process of Micro LED arrays with cylindrical and spherical In bumps using COMSOL. The results demonstrate that the displacement of the bumps after bonding decreases by up to 97% compared to the displacement observed during the temperature-holding phase. Furthermore, the stresses during the temperature rise and fall stages approximately exhibit a linear relationship with temperature, and residual stresses exist after bonding. Additionally, residual stresses remain present after bonding. This study provides theoretical guidance for optimizing the bonding process of Micro LED and further exploration for the commercialization of Micro LED.