Solder Joints Accelerated Degradation Model and Life Prediction Method Based on Gamma Process

In the rugged fire smoke environment, electronic equipment is easy to be damaged in a short time. Replacing all the damaged equipment will cause tremendous economic losses. As a key component of electronic equipment, the reliability and safety of solder joints after fire becomes an urgent problem to be solved. Therefore, accelerated degradation testing (ADT) is carried out for the solder joints after short-term damage in the fire smoke environment. The results show that the gamma stochastic process can be used to characterize the degradation of solder joints, and the Arrhenius equation can well describe the relationship between temperature and solder joint life. Based on this, an accelerated degradation model combining gamma process and Arrhenius equation was established. Combined with the data of ADT, a two-step method is proposed to estimate the degradation model parameters, and then calculate solder joints life after fire. The predicted life of solder joints is close to the experimental average life, indicating that the proposed method is suitable for predicting solder joints life after fire. It provides theoretical support for the reliability research of electronic equipment.