A Miniaturized Absorber for Radiation Suppression in the Chip Package

In this page, a miniaturized absorber with ultrawide absorption band is designed and applied for radiation leakage suppression in the chip package. The proposed unit is a double-layer structure with two patterned resistive films of ITO etched on top of the dielectric substrate. The patterned layer is composed of a meandering square ring and a centric circular patch which enhances the coupling within the unit and facilitates the miniaturization of the structure. The size of the unit is
$0.08\lambda_{\mathrm{L}}\times 0.08\lambda_{\mathrm{L}}(\lambda_{\mathrm{L}}$
is the wavelength in the free space of the lowest absorption frequency). When the periodic boundary condition is set in the simulation, it shows a broad absorption band
$(\mathrm{S}_{11}\leq-10\text{dB})$
covering 23.8-40 GHz. This unit is then used as a square ring structure for radiation suppression in chip package which demonstrates a −10dB bandwidth within 25.5-39.5 GHz.