Design of a High-Performance Power Supply Module with Subsection Compensation BGR and Capless LDO for Chip Applications

A high-performance power supply module for chip applications is presented in this paper using 180nm CMOS technology. The module includes a subsection compensation bandgap reference (BGR) and a capless low-dropout regulator (LDO) to address low temperature drift and low load adjustment (LDR) challenges. The temperature coefficient (TC) of the power supply module output voltage can be reduced using the subsection compensation technique. Additionally, the capless LDO with transient enhancement ensures proper functionality of the power supply module within the chip. Simulation results demonstrate that the proposed power supply module achieves a TC lower than 3 ppm/K, LDR lower than 0.002%, and overshot and undershot voltage lower than 400 $\mu$V, confirming its effectiveness in meeting low temperature drift and low load adjustment rate requirements.