An Innovative Non-invasive Analysis and Testing of Advanced Packaging Systems such as Antenna-in-Package and Antenna-on-Chip

In this paper, we describe emSCOPE™, a holistic Near-Field (NF) Over-The-Air (OTA) testing approach for Chip-Package-PCB-Antenna modules based on combined Thermoreflectance and a novel Thin-Film coating using SpinCrossover (SCO) materials. The SCO coating process demonstrates highly reliable thermometric performance (diffraction-limited sub-μm spatial, sub-μs temporal and 1 °C thermal resolution), which stems to a large extent from the unprecedented quality of the vacuum-deposited thin films of the molecular complex [Fe(HB(1,2,4-triazol-1-yl)3)2] used in this work. The resulting performance qualifies the SCO coating process, in terms of fabrication and switching endurance which surpasses 107 thermal cycles in ambient air, for industrial testing to ensure highly reproducible measurement results. The proposed near-field sensing solutions are demonstrated by several practical applications using Front-End-Modules (FEMs) manufactured with advanced GaN and Fully-Depleted Silicon On Insulator (FD-SOI) technologies co-designed with antennain package (AiP) modules based on heterogeneous System-in-Package and Wafer-Level-Chip-Scale-Packaging (WLCSP) fan-in/fan-out integration assemblies.