Simulation Modeling of 600mm X600mm Fan-Out Panel Level for Warpage Behavior Based on Chip First

According to market investigation and requirement in the future. Panel level package is promising, and focus on development in global assembly company. In this study, we can predict, estimate and be known for warpage behavior before processing. To evaluate what material, design. structure. thickness is available for large panel fan-out package. The factors of material are coefficient of thermal expansion (CTE), modulus, and design can study on fan-out ratio, structure, thickness, The simulation is demonstrated same trend with realistic result after sample build on 600X600mm large panel for warpage collection.