3D Fan-Out Wafer Level Packaging with Embedded Chip

The 3D Fan-Out Wafer-Level Packaging (3D-FOWLP) with embedded chip technology adopts advanced manufacturing processes and packaging methods, offering higher levels of integration, lower power consumption, smaller dimensions, and superior electrical performance compared to traditional packaging methods. It boasts advantages such as high reliability, mature manufacturing processes, and lower production costs, making it the ideal choice for many application fields. In this experiment, the 3D-FOWLP technology was employed to achieve chip stacking, thinning, and cost-effective structures. It features a low-risk manufacturing process, minimal packaging warpage, stable electrical performance, and excellent reliability. Successful integration was accomplished, including pre-fabricated layer RDL with embedded programmable chips and the stacking of customized layer RDL, MCU, Flash, and BLE heterogeneous chips. The thickness of the embedded chip RDL module is 160 µm, with a warpage of 66 µm, and it has passed reliability tests such as MSL3, TCT1000, and uHAST.