Multiscale simulation study of nano silver: from solid-phase sintering to bonding layer reliability assessment

Nano silver, a novel high-reliability lead-free encapsulation material, has been investigated in this study through the application of molecular dynamics simulation. The study reveals that the formation of sintered joints during the sintering process is the primary contributor to achieving robust interconnections. However, the presence of micro-pores within the sintered body adversely affects material performance. Subsequently, pivotal material parameters inferred from molecular dynamics simulation outcomes are employed to conduct finite element analysis of crack propagation within the nano silver bonding layer. The investigation highlights that the existence of micro-pores detrimentally impacts the reliability of the nano silver bonding layer. The simulation methodology presented in this paper serves as a technical reference for elucidating the sintering mechanism of nano silver materials and assessing bonding reliability.