Full-Wave Analysis of Interconnects in Finite Substrates with Layered Media Formulation of SVS-EFIE for 3D Composite Metal-Dielectric Structures

In this paper we demonstrate full-wave electromagnetic analysis of the IBM Plasma electronic package nets embedded into the multilayered substrate of finite extent within the framework of a layered medium integral equation formulation. Truncation of the substrate is obtained through inclusion of the finite dielectric regions of air into the otherwise ideal layered medium of the infinite extend. Such air regions introduce the desired effect of physical truncation of the substrate layers, while still allowing for use of integral equation formulations with the layered medium Green’s functions avoiding discretization of the layers. Computation framework is based on coupled system of layered medium Mixed Potential Integral Equation (MPIE) and Surface-Volume-Surface Electric Field Integral Equation (SVS-EFIE) suitable for analysis of general composite 3D metal/dielectric structures embedded in layered media.