Automatic improved-resolution imaging of composite adhesive joints using time-frequency-wavenumber filtering applied to ultrasonic guided wavefields

This paper presents an automatic damage imaging technique by employing a signal processing approach based on applying hierarchically clustered filters across different domains. The technique involves time-frequency-wavenumber filter banks which are applied sequentially to ultrasonic guided wave (UGW) data. The study is conducted for a single lap joint composite specimen with a special focus on small voids which were formed due to manual adhesive component mixing. UGW data are acquired with a 3D Scanning Laser Doppler Vibrometer (LDV) over the scan area of the bonded plate. UGWs are excited at the central frequency of 100 kHz by a single piezoelectric transducer mounted on the surface of the single plate. Within each domain of time, frequency, and wavenumber, four filters are designed which results in 64 distinct filtered wavefields. From each filtered wavefield, an image is obtained by using root-mean-square (RMS) calculation of the signals. The obtained results are then combined to create a final, improved-resolution image of the scan area. The final image is compared to the image obtained through RMS calculation of full wavefield with interpolation through Delaunay triangulation and the image obtained by X-ray radiography. The results show that the smallest void that could be detected has a diameter of 2.14 mm.