High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing

This paper contributes to fully additively manufactured packaged solutions for the integration of millimeter wave devices. We demonstrate the viability of building multiple dielectric layers to achieve interconnects with greater heights. Being able to use vertical space allows for the system to be distributed over multiple layers which allows for more compact systems in horizontal space. Encased printed transmission lines with minimal losses allows for increased compactness of future structures. Both iterations were designed for 30 GHz and in the worst case saw a loss of 0.12 dB/mm at 30 GHz. Our approach provides a flexible packaging solution for next-generation packaging technologies.