A Surface Mount Package Based on the SISL Platform

This paper proposes a novel surface mount package (SMP) based on the substrate integrated suspended line (SISL) platform, which will support the application of SISL surface-mount devices (SMD). The design details of the transition from SISL to the pads are carefully discussed, and the equivalent circuit of the SMP is also given. The proposed package is analyzed and optimized according to various factors including the equivalent circuit and practical considerations. Besides, a recommended layout for the test board is provided. A SISL SMP for DC to 6 GHz applications is designed, fabricated, and measured, which demonstrates the feasibility of the proposed SMP.