Armed Microstrip Patch: New Configuration with Promising Feature of High 3D Cross-Polar Discrimination

This work explores a novel approach of controlling cross-polar (XP) radiations of a microstrip patch without tampering its ground plane or introducing any additional engineering. It proposes a new possibility where the patch geometry could be improvised without involving any expensive design or fabrication procedures. This, to the best of our knowledge, is the first of its kind which promises at least 10dB XP reduction over its diagonal plane without any rigorous feeding or structural engineering. The proposed geometry has also been experimentally tested and extended to realize improved array revealing equal amount of XP reduction over 3D radiation planes.