A Prediction Method for Signal Transmission Performance of Lead Interconnect Based Configuration Characteristics in Electronic Packaging

With the demand for more powerful functions and miniaturization of electronic equipment, the requirements for complex interconnection design and manufacturing in electronic packaging are increasing. The pros and cons of interconnection configuration have a serious impact on its electrical performance and have become a key factor affecting the development of complex interconnection in electronic packaging. In order to better study the influence mechanism of the configuration parameters of lead interconnection, a method for predicting the electrical performance of lead interconnection in electronic packaging based on configuration characteristics is presented. First, the configuration parameters of lead interconnection are extracted, and then the parameterized characterization of lead interconnection is carried out. Taking the half-envelope rectangular lead interconnection as an example, the road coupling model of lead interconnection based on range analysis, variance analysis, and response surface method is built and experimentally verified. Finally, the influence mechanism of the configuration characteristics of lead interconnect on electrical performance is analyzed. The work carried out provides theoretical guidance for the lead interconnection design and fast prediction of electrical signal transmission performance in electronic packaging.