A Reusable Interposer for Multi-Chiplet Microsystems Reconfiguration

The advantages of Chiplet cannot be fully exploited in the microsystem for the lack of reconfiguration technology. A reusable interposer is proposed for the functional reconfiguration of multi-Chiplet microsystems, which is integrated with a signal routing Chiplet for dynamically adjusting the path between Chiplets and 3D heterogeneous interconnection (TSV and RDL) for signal transmission. The signal routing Chiplet is analyzed with an ABCD matrix. The insertion loss is less than 5 dB and isolation is greater than 45 dB from DC to 8 GHz. The interposer has huge potential for microsystem reconfiguration and miniaturization.