Design and Simulation of Triple-Band Directionl Coupler Based on Integrated Passive Devices Process

In this paper, a 3dB directional coupler with high performance using Integrated Passive Devices (IPD) process is designed. To achieve strong coupling, floating ground-plane conductor (FGPC) is etched on the ground plane. In addition, the wiggly-coupled lines are adopted to improve directivity. The result shows that the proposed IPD coupler has good performance in three bands, which potentially provides a innovative idea for designing harmonic-controlled Radio Frequency Power Amplifier (RFPA) circuits based on heterogeneous integration (HI).